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Security In Connected Cars Gets Into Gear With New Processors

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Home » Blog » Security In Connected Cars Gets Into Gear With New Processors

ST is helping connected car makers to address the cyber-security challenges with its new automotive processors that feature a dedicated, built-in security module.

The new Telemaco3P telematics and connectivity processors (STA1385 and its variants) are claimed to be the first automotive microprocessors to integrate a powerful, dedicated, isolated Hardware Security Module (HSM).

The on-chip HSM independently watches data exchanges and encrypts and authenticates messages. It securely checks the authenticity of received messages and any external devices that try to connect and protects against eavesdropping.

According to ST, the HSM makes Telemaco3P devices ahead of the general-purpose application processors typically found in current connected-car systems, which lack dedicated hardware-based security.

ST’s new chips are also extremely robust, with a 105°C maximum temperature rating for use in locations that can become extremely hot, such as on top or directly beneath the roof in a smart antenna.

“Realizing the benefits of connected cars requires strong protection against cyber-attacks,” said Antonio Radaelli, Infotainment Business Unit Director, Automotive and Discrete Product Group, STMicroelectronics. “Our new Telemaco3P processors combine ST’s proven expertise in hardware security and knowledge of the automotive industry’s standards and requirements to lay solid ground for safe and enjoyable connected motoring.”

The STA1385 is designed to comply with the automotive functional-safety standard ISO 26261, up to safety integrity level B (ASIL-B), and meet the AUTOSAR specification for protected communication across the CAN bus. Telemaco3P devices can run POSIX-compliant operating systems, giving users

Furthermore, the Telemaco3P devices can run POSIX-compliant operating systems, giving users the flexibility to choose the optimum OS for a variety of intended use cases.

ST is providing engineering samples of the STA1385 to lead partners now and full production is scheduled for mid-2018.

For further details, click here.

Upasana Dewan

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